MASTER BOND: Fast-Curing Adhesive With High Thermal Conductivity
June 6, 2005
Master Bond Inc. has introduced Master Bond EP24AN, a fast-curing, two-component epoxy adhesive with an exceptionally high thermal conductivity. EP24AN also features superior electrical insulation properties. This easy-to-use material has a 1:1 non-critical mix ratio weight or volume. It exhibits excellent adhesion to a range of similar and dissimilar substrates, and can offer a tensile shear strength of over 1,600 psi. In addition, gel times can be obtained in as little as 20 minutes. Master Bond EP24AN features a low coefficient of thermal expansion, low shrinkage and superb dimensional stability. It is available in ½ pint, pint, quart, gallon and 5-gallon kits.For more information, call (201) 343-8983 or e-mail email@example.com.