Specially formulated for automated assembly, new Dow Corning®HM-2520 Assembly Sealant combines the immediate green strength of a hot-melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load. 

This product is a neutral-cure, low-VOC sealant that enables parts to be moved immediately upon application. It also offers higher tensile strength for applications that require more secure adhesion.

HM-2520 Assembly Sealant maintains excellent adhesion to most common substrates.  It has a high tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C).  This product meets FDA Regulation CFR 177.2600 and is NSF 51 and NSF 61 listed.