Specially formulated for automated assembly, new Dow Corning®HM-2520 Assembly Sealant combines the immediate green strength of a hot-melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load.
This product is a neutral-cure, low-VOC sealant that enables
parts to be moved immediately upon application. It also offers higher tensile
strength for applications that require more secure adhesion.
HM-2520 Assembly Sealant maintains excellent adhesion to most
common substrates. It has a high tensile
strength of 700 psi and service temperatures ranging from -50° to 300°F (-45°
to 150°C). This product meets FDA
Regulation CFR 177.2600 and is NSF 51 and NSF 61 listed.
DOW CORNING: Assembly Sealant (3/31/09)
March 31, 2009