This company now offers Dow Corning’s EE-3200 low-stress silicone encapsulant, a product designed for the solar power industry. The new encapsulant reportedly provides a balance of low viscosity, room-temperature cure, low hardness and good thermal conductivity. The two-part silicone formulation can help minimize processing costs compared to competitive polyurethane encapsulant materials. Unlike polyurethanes, which often require pre-heating before application, this formulation reportedly eliminates the pre-heating step and enables electronic assemblies to be filled more quickly.

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