This company now offers Dow Corning’s EE-3200 low-stress silicone encapsulant, a product designed for the solar power industry. The new encapsulant reportedly provides a balance of low viscosity, room-temperature cure, low hardness and good thermal conductivity. The two-part silicone formulation can help minimize processing costs compared to competitive polyurethane encapsulant materials. Unlike polyurethanes, which often require pre-heating before application, this formulation reportedly eliminates the pre-heating step and enables electronic assemblies to be filled more quickly.
For more information, visit www.ellsworthadhesives.co.uk.