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Adhesives & Sealants HeadlinesCoatingsCuringFinished Adhesives and SealantsPressure-Sensitive Adhesives (PSAs)Raw Materials and Chemicals

RadTech Announces Call for Papers for 2016 Conference

Curing.jpg
May 7, 2015

RadTech International North America is accepting abstracts for RadTech UV&EB Technology & Conference 2016, scheduled for May 16-18, 2016, in Rosemont, Ill.

Technical papers should be no longer than 25 min in length, with five minutes for Q&A. The online Abstract Submission Form should be completed prior to September 4. Descriptions should be sufficiently comprehensive to allow assessment of the scope and content of papers by the Conference Committee. The committee will select papers, and speakers will be notified whether or not they have been selected by October 4. 

For more information, visit www.radtech.org.

KEYWORDS: associations call for papers

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