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Adhesives & Sealants Headlines

RADTECH ANNOUNCES CALL FOR PAPERS FOR UV & EB TECHNOLOGY EXPO

November 29, 2004
RadTech International has announced a Call for Papers for e|5: UV & EB Technology Expo & Conference, April 24-26, 2006, at Lakeside Center at McCormick Place in Chicago, IL. e|5 2006 is the foremost event for the UV and EB curing industry, and the conference program will feature key areas of interest to the industry. RadTech is seeking papers from the following categories, though other areas are also welcome: UV/EB Applications, Advances in Chemistries, Safety & Handling Issues, Advances in Curing Equipment, and Testing & Measurement Issues. Those interested in presenting a technical conference paper no longer than 25 minutes in length with 5 minutes for Q&A should complete the online Abstract Submission Form prior to July 1, 2005. Interested presenters may also call RadTech HQ at (240) 497-1243 or e-mail mickey@radtech.org to receive a paper version of the Call for Papers and Abstract Submission Form.

Call for papers website: http://www.radtech.org/e52006CallforPapers.html

Call for Papers Online Submission: http://www.formsite.com/radtech/e52006abstract/index.html

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