Silver-filled epoxy adhesive system EP3HTSDA-2 was developed for crucial thermal management applications. As a one-component system, it is not premixed and frozen, and reportedly has an unlimited working life at room temperature. It can be applied in ultra-thin bond lines and contains particles with an average size of 2-3 microns. This adhesive reportedly exhibits very low thermal resistance and has electrical conductivity with a volume resistivity less than 0.001 ohm-cm.
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