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Adhesives and Sealants TopicsColumnsFinished Adhesives and Sealants

Ask Dr. Dave

Could you please suggest an epoxy resin, along with a hardener and accelerator, to use as a raw material in the production of a high-temperature-resistant adhesive?

Dr. Dave provides details regarding the use of inorganic vs. organic adhesives for high-temperature applications.

By Dave Dunn Ph.D.
May 29, 2020

Question: Could you please suggest an epoxy resin, along with a hardener and accelerator, to use as a raw material in the production of a high-temperature-resistant adhesive? It may be a one- or two-part system. We need temperature resistance up to 500°C, and the adhesive will be applied to fill small gaps in a hot mild steel structure. The required initial setting time is 5 min.

Answer: That temperature is much too high for an epoxy adhesive. You almost certainly require an adhesive based on inorganic materials. In contrast to organic adhesives, where few can perform above 250°C, inorganic adhesives have been developed that offer a service temperature of over 2,000°C. These are based on inorganic binding compounds such as sodium silicates and various metal phosphates, with carbon, alumina, silica, magnesia, or zirconia powder fillers.

Ceramic adhesives can be formulated into one- or two-part systems and are often supplied as a water-based binder solution and ceramic filler that are mixed into a slurry for application as adhesives or sealants. Suitable selection of the binder and, more importantly, the filler allows the coefficient of thermal expansion of the adhesive to be matched to that of a substrate to minimize stresses during heating and cooling.

These adhesives are frequently used for very-high-temperature applications, particularly in bonding ceramics and ceramics to metals. Weaknesses of these adhesives often include brittleness, sensitivity to moisture, and lower adhesive strength than their organic counterparts.
 


Any views or opinions expressed in this column are those of the author and do not represent those of ASI, its staff, Editorial Advisory Board or BNP Media.

KEYWORDS: adhesives in assembly bonding gap fillers

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Dave dunn

Ask Dr. Dave is written by Dave Dunn, Ph.D., of F.L.D. Enterprises, a technical consultancy and full-service industrial market-research firm specializing in the adhesives, sealants, specialty rubbers and plastics fields. Dave is a former vice president and director of Loctite Corp. and has spent many years in troubleshooting adhesive and sealant problems. Questions for publication should be directed to him at 242 Trails End, Aurora OH 44202; phone (440) 477-5164; fax (330) 247-1690; or email DrDave242@windstream.net .

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