Adhesives Mag logo
search
cart
facebook twitter linkedin youtube
  • Sign In
  • Create Account
  • Sign Out
  • My Account
Adhesives Mag logo
  • NEW PRODUCTS
  • NEWS
    • Adhesives & Sealants Headlines
    • Mergers/Acquisitions
    • Events Calendar
    • Market Trends
  • TOPICS
    • Finished Adhesives and Sealants
    • Pressure-Sensitive Adhesives (PSAs)
    • Coatings
    • Raw Materials and Chemicals
    • Materials Handling/Processing
    • Meter/Mix/Dispense
    • Curing
    • Testing/Quality Control
    • Packaging of Adhesives & Sealants
    • Converting/Packaging
    • Composites
    • Sustainability
  • COLUMNS
    • European Perspectives
    • Strategic Solutions
    • Supply Chain Strategies
    • Tape Talk
  • TOP 20
  • MULTIMEDIA
    • Videos
    • Podcasts
    • Webinars
    • eBooks
  • EXPLORE
    • Adhesives in Action
    • Blog
    • ASI Store
    • Industry Links
    • Market Research
    • Classifieds
  • DIRECTORIES
    • Buyers' Guide
    • Global Adhesives & Sealants Directory
    • Raw Materials, Chemicals, Polymers and Additives Handbook
    • Equipment Handbook
    • Distributor Directory
  • EMAGAZINE
    • EMAGAZINE
    • ARCHIVE ISSUES
    • ADVERTISE
      • Custom Content & Marketing Services
    • CONTACT
  • SIGN UP!
NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesFinished Adhesives and Sealants

IPC Launches Thought Leaders Program to Enhance Awareness and Insights on Electronics Industry Trends

One of the program’s first projects will be a report on the U.S. Defense Department’s Cybersecurity Maturity Model Certification.

Electronics
March 30, 2021

IPC recently unveiled a new Thought Leaders Program in which industry experts will assist IPC on key industry issues and offer valuable insights to IPC members and key external stakeholders. IPC has retained a select group of experts to generate ideas and insights in five areas: education and workforce; technology and innovation; the economy; key markets; and environment, health, and safety.

"IPC is building its leadership on the issues that are driving change for the electronics manufacturing industry," said John Mitchell, IPC president and CEO. "As an association representing thousands of companies, we need to be astutely aware of a range of change drivers and how they are interconnected. IPC will leverage these experts' insights to lead and influence change for the better."

The Thought Leaders Program will be chaired by Mike Carano, an executive at RBP Chemical Technology and a member of IPC's Hall of Fame. "I'm thrilled and honored to coordinate the Thought Leaders Program and the work of this distinguished and diverse group of individuals," said Carano. "The industry is on the cusp of exciting change, and the thought leaders IPC has assembled will help guide the industry to new heights."

The Thought Leaders include:

  • Mike Carano (Chair), vice president of Technology & Business Development, RBP Chemical Technology
  • Olivier Coulon, consultant, Decision Etudes & Conseil
  • Payman Dehghanian, assistant professor of Electrical and Computer Engineering, The George Washington University
  • Bryan Erwin, managing partner, BlueWave Merchant Partners
  • Denny Fritz, consultant
  • Savita Ganjigatti, vice president of Engineering, Sienna Ecad Technologies
  • Carol Handwerker, professor of Materials Engineering, Purdue University
  • Matt Holzmann, president, CGI Americas
  • Meredith LaBeau, director of Process Engineering, Calumet Electronics
  • Joe O'Neil, CEO of Green Circuits
  • Leslie Weinstein, founder/CEO, CMMC Consulting

The Thought Leaders' responsibilities will include: providing publishable material in their subject areas; flagging opportunities for IPC engagement; and participating in quarterly roundtable discussions. Each expert is expected to fulfill at least one 12-month term, during which quarterly contributions will be expected.

One of the program's first projects will be a report on the U.S. Defense Department's Cybersecurity Maturity Model Certification (CMMC), an effort to better protect the cybersecurity of the defense industrial base. The electronics industry supports this initiative but has concerns about its ongoing implementation.

For additional details, visit www.ipc.org.

KEYWORDS: adhesives in electrical/electronic associations sealants in electrical/electronic

Share This Story

Looking for a reprint of this article?
From high-res PDFs to custom plaques, order your copy today!

Recommended Content

JOIN TODAY
to unlock your recommendations.

Already have an account? Sign In

  • mouse in hole

    Using Foam Sealants for Pest Prevention

    According to the National Pest Management Association,...
    Finished Adhesives and Sealants
    By: Kevin Corcoran
  • linked network nodes

    Using the Power of AI for Adhesive and Sealant Formulation

    With the help of software solutions, adhesive formulators...
    Adhesives and Sealants Topics
    By: Karen Parker
  • top20-hero.jpg

    2024 ASI Top 20: Leading Global Manufacturers of Adhesives and Sealants

    ASI's annual ranking of the top 20 global adhesive and...
    Finished Adhesives and Sealants
Subscribe For Free!
  • eMagazine Issues
  • eNewsletter
  • Online Registration
  • Manage My Preferences
  • Subscription Customer Service

More Videos

Popular Stories

Picture of white beads of hot-melt adhesives

Henkel and Synthomer Work to Cut Carbon Emissions in Adhesives

Image of a green plant

BioBond Licenses Technology Developed at Purdue to Create Biodegradable Packaging Adhesives

Photo of shoe on shovel breaking into dirt

PPG to Build New Manufacturing Facility in North Carolina for Aerospace Coatings and Sealants

ASI Top 20 website

Events

January 1, 2030

Webinar Sponsorship Information

For webinar sponsorship information, visit www.bnpevents.com/webinars or email webinars@bnpmedia.com.

View All Submit An Event

Products

Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

See More Products

ASI CASE EBOOK

Related Articles

  • Electronics

    Electronics Manufacturing Sector Calls on Leaders of U.S., Mexico, and Canada to Boost Cooperation During COVID-19 Recovery

    See More
  • Auto-900

    IPC and Automotive Industry Action Group Enhance Partnership Agreement

    See More
  • EditorsBlog-Susan

    Industry Leaders Share Insights at the 2020 World Adhesive and Sealant Conference

    See More

Related Products

See More Products
  • handbk-of-ad-and-surface-pr.gif

    Handbook of Adhesives and Surface Preparation

  • adhesive-bonding-materials.gif

    Adhesive Bonding: Materials, Applications and Technology

  • adhesive-bonding-science.gif

    Adhesive Bonding: Science, Technology, and Applications

See More Products

Events

View AllSubmit An Event
  • October 24, 2019

    Additive Electronics Conference: PCB Scale to IC Scale

    Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
View AllSubmit An Event
×

Keep the info flowing with our eNewsletters!

Get the latest industry updates tailored your way.

JOIN TODAY!
  • RESOURCES
    • Advertise
    • Contact Us
    • Directories
    • Store
    • Want More
  • SIGN UP TODAY
    • Create Account
    • eMagazine
    • eNewsletters
    • Customer Service
    • Manage Preferences
  • SERVICES
    • Marketing Services
    • Reprints
    • Market Research
    • List Rental
    • Survey & Sample
  • STAY CONNECTED
    • LinkedIn
    • Facebook
    • Youtube
    • X (Twitter)
  • PRIVACY
    • PRIVACY POLICY
    • TERMS & CONDITIONS
    • DO NOT SELL MY PERSONAL INFORMATION
    • PRIVACY REQUEST
    • ACCESSIBILITY

Copyright ©2025. All Rights Reserved BNP Media.

Design, CMS, Hosting & Web Development :: ePublishing