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Home » Topics » News

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China Surpasses U.S. as Top Smartphone Market

July 19, 2013
China will displace the U.S. as the largest smartphone market this year, according to a new study from ABI Research.
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GM, Honda to Collaborate on Next-Generation Fuel Cell Technologies

July 18, 2013
General Motors and Honda recently announced a long-term, definitive master agreement to co-develop next-generation fuel cell system and hydrogen storage technologies, aiming for the 2020 timeframe.
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Nordson CEO Hilton Named Entrepreneur of the Year

July 18, 2013
Nordson Corp. recently announced that President  and CEO Michael F. Hilton has received the Ernst & Young Entrepreneur of the Year® 2013 award in the Public Company Category for the Northeast Ohio Region.
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Becker Named Henkel VP-Product Development and Engineering

July 18, 2013
The Electronics Group of Henkel recently announced it has named Kevin Becker, Ph.D., to lead its global Product Development and Engineering (PD&E) team.
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Caiaffa Named Chromaflo Sales Manager for Brazil

July 17, 2013
Chromaflo Technologies Corp. recently announced it has contracted a new sales manager in Brazil.
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China Structural Adhesive Output Remains Strong

July 17, 2013
In 2007-2011, China’s output of structural adhesives presented a compound annual growth rate of 16.6%, higher than the growth rate of 13.6% of the adhesive industry in the same period.
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Dow Corning Joins imec

July 17, 2013
Dow Corning recently announced it has joined imec, a leading research center for the advancement of nano-electronics.
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Mishra Joins Royce International

July 16, 2013
Royce International recently announced that Vinay Mishra, Ph.D., has joined the company as director of Technology and Business Development.
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Pilot Chemical Completes Expansion

July 16, 2013
Pilot Chemical Co. recently announced the completion of the largest infrastructure investment in the company’s history at its Middletown, Ohio, facility.
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LANXESS Relocates in Germany

July 15, 2013
LANXESS recently announced it is relocating its headquarters to Cologne.
Read More
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