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Home » Topics » News » Adhesives & Sealants Headlines

Adhesives & Sealants Headlines
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POLYSCIENCES: Liquid Encapsulant

February 1, 2005
Polysciences, Inc. has introduced its LoSTRESS low-modulus liquid encapsulant for electronics applications.
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Speedline To Present Lead-Free Manufacturing Process Webinar

February 1, 2005
SMT manufacturing experts will explore the day's leading lead-free SMT manufacturing process challenges in a free, live webcast seminar set for Thursday, Feb. 17, 2005 at 11:00 EST.
Read More

Maroon Appoints McKenna Business Development Manager

February 1, 2005
Maroon Inc., a privately held specialty chemical distributor based in Avon, OH, has announced the appointment of Michael F. McKenna as business development manager.
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Henkel Announces Opening Of New Research And Applications Center

February 1, 2005
The electronics group of Henkel has announced the grand opening of its Irvine, CA, Research and Applications Center.
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SME Announces RFID Management Forum

February 1, 2005
The Society of Manufacturing Engineers (SME) will present a management forum entitled "RFID: Making Waves - Integrating RFID Technology into Your Supply Chain."
Read More

UCAR Emulsion Systems Announces Sales Control On All Latex Products

February 1, 2005
UCAR Emulsion Systems (UES), a business unit of The Dow Chemical Co., has announced sales control for all latex products in North America and Puerto Rico.
Read More

Hyde Acquires Roman Decorating Products

February 1, 2005
The Hyde Group from Prairie Capital, a Chicago-based private equity company, has purchased Roman Decorating Products, Inc.
Read More

Eastman To Highlight Enabling Technologies For Nonwovens At INDEX 2005

January 27, 2005
Eastman Chemical Co. will introduce its latest enabling technologies for the global nonwovens market at INDEX 2005 in Geneva, Switzerland, on April 12-15 at Booth #2554.
Read More

Henkel Donates $1.35 Million For Tsunami Aid

January 27, 2005
Henkel has announced a cash donation pledge of $677,000 as immediate aid following the tsunami disaster in South Asia.
Read More

SMTA International Call For Papers Deadline Approaches

January 27, 2005
The SMTA International Technical Committee is currently welcoming abstract submissions for its 2005 conference.
Read More
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