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Home » Topics » News » Adhesives & Sealants Headlines

Adhesives & Sealants Headlines
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MD-Both Industries Signs Superior Materials Inc.

March 7, 2005
MD-Both Industries has announced the appointment of Superior Materials Inc., Garden City, NY, as their new sales agent in the Northeast region.
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H.B. Fuller Files Fiscal Year 2004 Form 10-K

March 7, 2005
H.B. Fuller Co. has announced that it has filed with the Securities and Exchange Commission, within the extended time period allowed under Rule 12b-25, its Annual Report on Form 10-K for its fiscal year ended Nov. 27, 2004.
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Avery Dennison Elects Scarborough Chief Executive Officer

March 7, 2005
Avery Dennison Corp. has announced that its board of directors has elected Dean A. Scarborough president and CEO, effective May 1, 2005.
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Announcing 2005 ASI/ASC Joint Seminar

March 7, 2005
"Building Strategic Alliances: Doing Business with China and India"

Plan Now to Attend May 17, 2005 at the Embassy Suites Hotel at Baltimore's BWI airport

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Michelman Opens Office In Shanghai

March 7, 2005
Michelman has announced the opening of their China Office on October 25, 2004.
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Asia FlexPak Conference Scheduled For June

March 7, 2005
The 4th Asia FlexPak Conference, organized by Centre for Management Technology (CMT), has been scheduled for June 20-21 in Guangzhou, China.
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Grace Acquires Midland Dexter Venezuela S.A.

March 7, 2005
W.R. Grace & Co. has announced the acquisition of certain assets of Midland Dexter Venezuela, S.A. (Midevensa).
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TRFA Calls For Technical Papers For 2005 Annual Meeting

March 7, 2005
The Thermoset Resin Formulators Association (TRFA) invites the submission of Technical Papers for presentation at the association's 2005 Annual Meeting.
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Scapa Names Lennon Chief Operating Officer

March 7, 2005
Scapa Group plc has appointed Stephen D. Lennon as Chief Operating Officer of Scapa North America.
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Pan Pacific Symposium Best Paper Award Annouced

March 7, 2005
Speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
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