Pan Pacific Symposium Best Paper Award Annouced
Speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
Speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium (Jan. 25-27, 2005, Kauai, HI) promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, the Best Paper Award was presented to Alan Rae of NanoDynamics, Inc. In his paper entitled "Nanotechnology and Low Temperature Electronics Assembly," Rae reviews "concerns among board assemblers that some components are not - and will not - be ready for 100% lead-free assembly. In addition, assemblers of `exempt' boards serving the military, aerospace, and automotive industries are finding that lead-containing components may no longer be available and will force conversion of these complex boards." Rae goes on to discuss how nanotechnology enables a number of tools that will allow lower temperature assembly through enhanced solders, adhesives and novel attachment methods.
Speakers at SMTA's Tenth Annual Pan Pacific Microelectronics Symposium (Jan. 25-27, 2005, Kauai, HI) promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. As rated by the attendees, the Best Paper Award was presented to Alan Rae of NanoDynamics, Inc. In his paper entitled "Nanotechnology and Low Temperature Electronics Assembly," Rae reviews "concerns among board assemblers that some components are not - and will not - be ready for 100% lead-free assembly. In addition, assemblers of `exempt' boards serving the military, aerospace, and automotive industries are finding that lead-containing components may no longer be available and will force conversion of these complex boards." Rae goes on to discuss how nanotechnology enables a number of tools that will allow lower temperature assembly through enhanced solders, adhesives and novel attachment methods.
For more information, visit http://www.smta.org/pan_pac.
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