SMTA Finalizes Pan Pacific Microelectronics Symposium Program
The Pan Pacific Microelectronics Symposium reportedly promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the world.
SMTA recently announced that the program is finalized for its 25th Annual Pan Pacific Microelectronics Symposium, which will take place February 10-13, 2020, at the Westin Hapuna Beach Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium reportedly promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the world.
In addition to several keynotes, the program features research from global experts on topics such as Advanced Packaging and Processing, Advanced Materials, Electrochemical Migration & Creep Corrosion, Printed Electronics, Reliability, Roadmaps, Smart Factory/i4.0, and Test Methods. On the afternoon of Monday, February 10, a plenary session kicking off the event will feature presentations on “Advances in Power Electronics,” “Healthcare Gaps That Only Technology Can Fill,” and “The Origins of Silicon Valley,” as well as a special presentation of “Astronomy Future Cast” by the Mauna Kea Observatory.
On Tuesday, February 11, Eric Fossum, Ph.D., Thayer School of Engineering, Dartmouth College, will deliver the keynote lunch talk on “The Invention of CMOS Image Sensors: A Camera in Every Pocket.” The lunch keynote on Wednesday, February 12, will be given by John Quackenbush, Ph.D., of Harvard University. He will discuss “Using Healthcare Data to Advance Precision Medicine.” Ricky Lee, Ph.D., HK UST, will deliver the final keynote lunch presentation about “Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging with Multi-layer RDL” on Thursday, February 13.
To view the complete program and register, visit www.smta.org/panpac.