Converting/Packaging
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IoPP Continues Partnership with PACK EXPO

The Institute of Packaging Professionals recently announced it plans to contribute to this year’s PACK EXPO International.
PACK EXPO International will take place November 6-9 in Chicago.
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Electronics for Imaging Relocates

Electronics for Imaging Inc. recently announced it will move to a new facility in Londonderry, N.H.
The facility, which will be nearly 250,000 sq ft in size, is scheduled to be completed in early 2018.
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TAPPI Launches Online Forum

TAPPI recently announced the launch of its new online forum, TAPPI Connect.
The platform reportedly provides an online resource for members, non-members and volunteers to collaborate.
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Henkel Collaborates with HP

Henkel Adhesive Technologies is reportedly helping to further establish digital printing within the flexible packaging industry.
Henkel and HP intend to provide solutions combining printing ink technology with adhesives.
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Nordson-Ebeling

Ebeling Named Nordson Director of Engineering, Operations

Nordson Corp. recently announced it has named Thomas Ebeling, Ph.D., to be director of engineering and operations for extrusion and coating dies.
He will be in charge of the engineering and production teams for EDI™ extrusion and polymer coating dies and Premier™ fluid coating dies.
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