Curing

Achieving Adhesion to Difficult Substrates

A new material can be used to improve adhesion in a variety of substrates.

September 2, 2014

Adhesion, or lack of it, is one of the most critical attributes for most adhesives, coatings and inks. A variety of options can be explored when it comes to adhesion.

EXCELITAS TECHNOLOGIES CORP.: UV LED Controller

August 27, 2014

This company now offers the PLC2000 controller and AC optical adapter, two accessories intended to complement the OmniCure AC series of high-power UV LED systems.

RadTech Announces Webinar on UV-Curable Materials for 3D Printing

August 19, 2014

RadTech recently announced it has partnered with SUNY/ESF to present a free webinar on UV-curable material development for 3D printing.

Continued Growth Expected for UV-Curable Resins Market

August 13, 2014

The global UV-curable resin market, along with its end products, has seen significant growth in the past few years.

ELLSWORTH ADHESIVES EUROPE: Dymax LED Flood System

July 29, 2014

This company offers the new BlueWave LED flood system from Dymax.

DELO: Spot-Curing Lamp

July 3, 2014

A new high-intensity LED spot lamp with a wavelength of 400 nm is now available.

Rapid Adhesive Bonding by Induction and Microwave Curing

Induction and microwave curing procedures must be evaluated and customized according to the specific application.

Arno Maurer

June 2, 2014

Adhesive bonding in industrial production often requires very short curing times. In the case of reactive adhesives, this generally means high curing temperatures.

Advancements in UV LED Curing Technology for Adhesives

The gaps that previously existed between traditional lamp solutions and UV LED-based curing systems have been narrowed.

Pamela Lee

June 2, 2014

Assembly and manufacturing processes are highly dependent on the rapid and effective curing of ultraviolet (UV) adhesives. Historically, mercury arc lamps have been used as the curing source in a wide range of industrial applications and processes to polymerize adhesives.