Finished Adhesives and Sealants

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Dow Automotive Systems and LORD Corp. have entered into a commercial agreement to bring Fusor® 2098 crash-durable structural adhesive to the North American automotive aftermarket.

A new generation of flip-chip underfill solution is now available that combines a T_g of > 240°C and novel stress absorbing capabilities.

These projects will reportedly help businesses cut energy costs through improved efficiency while also reducing carbon pollution.

RAMPF recently announced winners of its first Innovation Awards, which recognize highly innovative achievements by RAMPF Group staff.

Dow Corning recently announced that its TPSiV^® 4000 and 4200 thermoplastic elastomers (TPEs) have been shown to be safe for skin contact applications in two independent medical test protocols.

Franklin Adhesives & Polymers recently announced that its Covinax 383-19, developed for use in extreme environmental conditions, has met Section 2 of the Standard BS 5609:1986, “Printed Pressure-Sensitive, Adhesive Coated Labels for Marine Use,” when coated on white vinyl face on paper liner.

The global UV-curable resin market, along with its end products, has seen significant growth in the past few years.

3M recently reported second quarter sales of $8.1 billion, an increase of 4.9% year-on-year.

Sika Corp. recently announced that Sandra DeRoso has been appointed to the position of Procurement manager Region NA Automotive.

ITW recently announced that Devcon^® brand, a product line of ITW Polymers Adhesives North America, will mark its 60th anniversary in September.