THERM-A-GAP GEL 120 from Parker Chomerics is a reworkable, high-performance, one-component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K.
Tecbond 114 from Power Adhesives has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.
Industry experts will gather in Nashville to explore AI-driven manufacturing, economic trends, and sustainable innovation shaping the future of adhesives and sealants.
The 2026 ASC Annual Convention & EXPO heads to Nashville with a forward-looking agenda designed to help adhesives and sealants professionals navigate disruption and drive growth.