Adhesive & Sealant Products

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This company has introduced a new line of drum-cleaning systems.

This company has produced a series of new bonding adhesives that are completely dissolved by hot, aqueous chemistries.

This company’s True Dual Seal Edge™ (TDSE) automated co-extrusion process is designed to apply INSUL-CURE™ IG sealant and THERMO-SEAL™ hot melt sealant simultaneously in insulating glass manufacturing.

This company offers the CHIPSHEILD 2000 line of single-component, UV- and thermally activated epoxy products.

This company has introduced the PD1 Head Driver to enhance the performance of electric heads in hot melt applicator systems.

This company introduces the NatPack-X™ cubic-yard-size intermediate bulk container (IBC), which is uniquely authorized for all three UN packaging groups.

This company’s new Hightemp 221FG is a single-component, room-temperature-stable, smooth epoxy potting compound that can withstand continued high-temperature use.

This company’s CE 3100 electrically conductive adhesive is a lead-free alternative to solder for surface-mount device (SMD) interconnect formation.

This company’s new packaging adhesives feature a family of 3M™ Jet-melt™ Adhesives and 3M™ Gummy Glue Removable Adhesive.

This company introduces Hydroment Plus, the first ceramic-tile grout to meet ANSI A118.6 H-4 and A118.7 specifications for polymer-modified grout.