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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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Ricon Resins: Ricacryl® 3803 and 3820 resins

July 26, 2000
Ricon Resins has introduced Ricacryl® 3803 and 3820 resins developed specifically to overcome limitations of adhesion of UV/EB resins to difficult substrates.
Read More

MacMillan Bloedel Bulk Packaging: Seamless IBC

July 26, 2000
SpaceKraft® UltraCUBE™ is a new IBC based on the company’s patented technology, which eliminates the manufacturer’s joint to offer a seamless, seven-wall-thick corrugated sleeve with 17 tons of compression strength.
Read More

Disti-Kleen: Drum-Cleaning Systems

July 26, 2000
This company has introduced a new line of drum-cleaning systems.
Read More

Moore Enviro-Chemical: Hot-Aqueous-Soluble Adhesives

July 26, 2000
This company has produced a series of new bonding adhesives that are completely dissolved by hot, aqueous chemistries.
Read More

H.B. Fuller: Dual-Seal Process

July 26, 2000
This company’s True Dual Seal Edge™ (TDSE) automated co-extrusion process is designed to apply INSUL-CURE™ IG sealant and THERMO-SEAL™ hot melt sealant simultaneously in insulating glass manufacturing.
Read More

Electronic Materials: UV- and Thermally Activated Epoxies

July 26, 2000
This company offers the CHIPSHEILD 2000 line of single-component, UV- and thermally activated epoxy products.
Read More

Slautterback: Head Driver for Hot Melt Systems

July 26, 2000
This company has introduced the PD1 Head Driver to enhance the performance of electric heads in hot melt applicator systems.
Read More

National Packaging Services: IBC

July 26, 2000
This company introduces the NatPack-X™ cubic-yard-size intermediate bulk container (IBC), which is uniquely authorized for all three UN packaging groups.
Read More

Cambridge Industries of America: High-Temperature Potting Compound

July 26, 2000
This company’s new Hightemp 221FG is a single-component, room-temperature-stable, smooth epoxy potting compound that can withstand continued high-temperature use.
Read More

Emerson & Cuming: Electrically Conductive Adhesive

July 26, 2000
This company’s CE 3100 electrically conductive adhesive is a lead-free alternative to solder for surface-mount device (SMD) interconnect formation.
Read More
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