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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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VANDEMARK: Vilsmeier Reagent

September 12, 2011
Vilsmeier reagent [(chloromethylene) dimethylammonium chloride] is designed for use in dehydration, chlorination and formylation reactions.
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HENKEL: Plastics Bonding Guide

September 9, 2011
The 96-page guide provides detailed technical information on the seven leading adhesive technologies that can bond the 30 most common plastic substrates.
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3M: Spray Adhesives

September 8, 2011
This company’s Industrial Adhesives and Tapes Division has launched new low-VOC aerosol spray adhesives with an up to 50% reduction of VOCs.
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AVERY DENNISON: Shrink Labels

September 7, 2011
The patent-pending Avery Dennison Shrink PS is engineered to survive the vacuum-shrink process without wrinkling, providing both shelf appeal and production-related benefits.
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SHERWIN-WILLIAMS: Epoxy Floor Coating System

September 6, 2011
This company has reportedly launched the industry’s first static control water-based epoxy floor coating system.
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DYMAX: Radiometer

September 2, 2011
The ACCU-CAL™ 150 is reportedly a simple-to-operate radiometer that offers repeatable measurement of UV light, which simplifies both the validation and monitoring of a UV light-curing process.
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CORTEC: Railcar Coating

September 1, 2011
VpCI®-380 is a fluoropolymer-modified, water-based acrylic that has been designed specifically for the railway industry.
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SEALANT EQUIPMENT & ENGINEERING: Dispensing System

August 31, 2011
This company’s new pneumatic servo dispensing (PSD) system is a positive rod displacement metering system that reportedly combines the cost efficiency of a pneumatic drive motor with the controlling accuracy of a servo drive motor.
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CHARLES ROSS & SON CO.: Planetary Dual Disperser

August 30, 2011
The planetary dual disperser (PDDM) is reportedly ideal for the powerful mixing of high-viscosity applications requiring ultra-fine dispersion quality.
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FLEXCON: Polyimide Films

August 29, 2011
THERMLfilm® HT™ is a new advanced line of high-temperature polyimide films reportedly able to withstand the fluctuating temperatures, abrasion and chemicals inherent in the printed circuit board (PCB) manufacturing process.
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