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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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TruSeal Adds Cost Estimator To Web Site

January 19, 2004
The online Cost Estimator developed by TruSeal Technologies, Inc. is designed to help fabricators determine their existing system's applied cost and estimated potential savings by using TruSeal's flexible spacers over a multitude of other systems.
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Ashby Cross: Updated Meter, Mix And Dispense System

January 19, 2004
Ashby Cross has introduced a version of their 1125 Variable Ratio meter, mix and dispense system that controls shot size by encoder.
Read More

DYMAX: Adhesives For Choke And Transformer Assembly

January 19, 2004
DYMAX has introduced a new line of light and activator curing adhesives for choke and transformer assembly that cure and fixture in seconds, making automation of gapped and ungapped cores easier and faster.
Read More

Zymet: Reworkable Underfill Encapsulant

January 19, 2004
Zymet has introduced a new reworkable underfill encapsulant, CN-1432, designed for CSP and BGA encapsulation.
Read More

Tra-Con: Coil-Fix Epoxy Adhesive

January 19, 2004
Tra-Bond CA20 is a thixotropic epoxy adhesive system specially formulated for shortened turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is required.
Read More

Clariant: Polypropylene Wax Grafted With Maleic Anhydride

December 11, 2003
Clariant's Pigments and Additives Division presents Licomont AR 504, a polypropylene wax grafted with maleic anhydride intended for use in natural fibre reinforced plastics.
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Henkel Loctite Introduces No-Clean Sustained Activity Liquid Flux

December 11, 2003
Henkel Loctite Corp. has introduced Loctite Multicore MFR301, a no-clean sustained activity liquid flux designed for wave soldering PCBs, especially those with copper substrates.
Read More

CVC Specialty Chemicals: Modified Bisphenol A Epoxy Resin

December 11, 2003
EPALLOY 7200 is the newest product in the CVC line of undiluted resins.
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Speedline Technologies: MPM Next Generation Pump

December 11, 2003
Speedline Technologies Inc. has introduced MPM's next generation pump technology, a design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials.
Read More

S+E Celebrates Start Up Of Coating Machine

December 11, 2003
Schleipen & Erkens AG celebrated the official start up of a new coating machine on Nov. 10.
Read More
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