LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors.
Creative Materials Inc. recently launched a series of multi-purpose conductive epoxies that combine flexibility with fine-line precision and extreme durability.
A new thermally conductive gap filler for applications in power electronics, SEMICOSIL® 9649 TC is a silicone product that can withstand high thermal stresses.
Avery Dennison Yongle’s new generation of PVC 2.0 low-VOC tapes are engineered for automotive interiors and environments where low fogging, low odor, and low emissions are required.
IST America’s Nitrogen Inert UV Curing System includes a nitrogen distribution cabinet, custom-engineered low-oxygen chambers, and a continuous residual oxygen analyzer.