Adhesives & Sealants Industry Top Stories

RSS

From May 15-19, nearly 300 pressure-sensitive adhesive (PSA) tape professionals—including scientists, professors, CEOs, VPs and sales professionals—gathered at the Mandalay Bay Las Vegas Convention Center for the Pressure Sensitive Tape Council’s (PSTC) Tape Summit 2017.

The adhesives and sealants supply chain is complex. The diversity of applications means an assortment of customers. In addition, strong growth in housing markets, infrastructure spending, and automotive sales is occurring worldwide (with higher growth in Asia-Pacific), creating a unique set of fulfillment challenges.

FLEXcon Co. Inc. recently collaborated with Polestar Technologies in Needham Heights, Mass., a company that specializes in high-tech sensors and monitoring equipment. Optical sensor technology is being used with life-support systems such as the mixed gas rebreathers used by emergency personnel, as well as for recreational diving.

The flexible packaging market is projected to expand from $102.19 billion in 2017 to $131.65 billion by 2022, growing at a compound annual growth rate (CAGR) of 5.2%, according to  a recent report from MarketsandMarkets™. Demand is growing for the global flexible plastic packaging market due to an increase in manufacturing activities and rising demand for conveniently packaged products.

Global demand for labels in pharmaceutical applications is projected to increase 7.1% annually to 5.1 billion sq m in 2020, the fastest growth rate among major label markets, according to a new study from The Freedonia Group.

If the past year taught us anything, it’s that the world is becoming an unpredictable place and change is the only constant. In the Asia-Pacific region, the convergence of economic, technological, customer and regulatory forces are remaking the market into a more dynamic, inclusive playing field. With this transition, we expect to see consistent demand for reliable products, breakthrough technology and innovative high-impact solutions.

Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.

According to Grand View Research, the global market for wearable medical devices is expected to reach $27.8 billion by 2022.1 Dow Corning reportedly sees the role of specialized adhesive technologies as a key driver of this growth, especially in skin- adhered medical devices, a major segment of the wearables market.

FEICA’s 2017 European Adhesive and Sealant Conference and Expo takes place September 13-15 in Forte Village, Santa Margherita di Pula, Sardinia, Italy. The event consistently attracts more than 500 industry professionals from around the world.

The global nonwoven adhesives market is estimated to reach $2.8 billion by 2022, growing at a compound annual growth rate (CAGR) of 9.9% from 2016 to 2022, according to “Nonwoven Adhesives Market by Type, and by Application: Global Opportunity Analysis and Industry Forecast, 2014-2022” from Allied Market Research. The ethylene vinyl acetate segment reportedly dominated the market in 2015, with around half of the market volume share.