DEARBORN, Mich. — Adhesives 2000 will be held September 27-28, 2000, at the Rosemont Convention Center near Chicago. Sponsored by the Society of Manufacturing Engineers, and endorsed by Adhesives & Sealants Industry magazine, the conference offers presentations designed to showcase the most profitable and effective use of adhesives in many different manufacturing applications, as well as provide information about breakthroughs in new adhesive technologies.

This year’s conference will also feature a one-day course on September 26 focusing on Fundamentals of Adhesive Bonding. This course will highlight a broad-based foundation in adhesives technology. A two-day course, Assembly Plant Layout, will be held September 26-27. The course will highlight the methods used by world-class manufacturing and assembly plants to optimize their plant layouts.

At press time, there were still some opportunities for speakers to participate at this year’s event. Suggested topics include: Metal Bonding; Wood Bonding; Plastic Bonding; Hot Melt Adhesives; Pressure Sensitive Adhesives; Adhesives for Specific Industry Uses; Testing/Standards/ Quality; New Applications and Technology Breakthroughs; Automotive Issues; Future Trends; Dispensing; and Case Studies.