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Adhesives & Sealants Headlines

SMTA INTERNATIONAL ANNOUNCES CALL FOR PAPERS

December 6, 2004
The SMTA International Technical Committee has requested abstract submissions for the 2005 SMTA International conference, to be held Sept. 25-29 at the Donald Stephens Convention Center in Rosemont, IL. The abstract deadline is Feb. 7, with acceptance notifications going out by April 15 and manuscripts due July 22. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature. Papers are being solicited in the following categories: Emerging Technologies; Components; Assembly; PCB Technology, Process Control; and Business. Short course descriptions are also being solicited.

For more information, visit http://www.smta.org/smtai/call_for_papers.cfm .

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