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Adhesives & Sealants Headlines

SMTA International Call For Papers Deadline Approaches

January 27, 2005
The SMTA International Technical Committee is currently welcoming abstract submissions for its 2005 conference. Short course descriptions are also being solicited. The deadline for abstracts is Feb. 7, 2005, with acceptance notices going out by April 15 and manuscripts due on July 25. Papers should describe significant results from experiments, emphasize new techniques and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature. Papers are being solicited in the following categories: Emerging Technologies; Components; Assembly; PCB Technology; Process Control; and Business.

Interested parties can find the online abstract submission form at http://www.smta.org/smtai/call_for_papers.cfm.

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