ASC Spring Program Highlights of the Day: Wednesday, April 22

Attendees will begin their day at 7:30 a.m. on Wednesday, April 22, with a General Keynote Session Breakfast. Michael Cohen, president of Business Development for Industrial SkyWorks; and Charles Houk, president of Commercial Sealants and Waterproofing for Tremco Inc.; will present “Enhancing Building Performance with Drone Technology.” The presentation will highlight how drone technology is providing customer value for Tremco Roofing & Building Maintenance, as well as the potential for using this technology for vertical wall systems.

Morning Education Sessions begin at 9:15 with tracks focusing on the topics of Building Envelope, Sealant Optimization and Bioinspired Technology.

From 12:30-1:30 p.m., attendees can take part in the General Keynote Session Lunch, where Dave Parillo, Global Research and Development director for Packaging and Specialty Plastics with The Dow Chemical Co., will discuss “How Packaging Sustainability Trends are Driving Adhesives Innovation.” This presentation will describe sustainability trends in packaging and the resulting new adhesive technologies being developed that provide the needed bonding performance and efficiency while also delivering an improved environmental profile.

At 1:45 p.m., educational sessions resume with the following tracks: Forecasting Business Strategies, Equipment and Testing and Bioinspired Technology.

From 4-5 p.m., the Closing General Session takes place. David Nick, president and CEO of DPNA International Inc., will give the Closing Keynote, “A Fresh Perspective: The Outlook for the Adhesive and Sealant Industry, 2015 and Beyond.” The presentation will highlight significant market adjustments as the adhesives and sealants industry moves beyond the past recession and market contractions.

After the Closing Session, delegates can network at the Closing Reception from 5-6 p.m.

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