In a move reportedly designed to offer customers greater access to low pressure molding solutions and its TECHNOMELT materials, Henkel Adhesive Technologies recently announced it has formed a partnership with molding equipment manufacturer LPMS USA.
“Henkel’s new relationship with LPMS USA is a very important development for our Americas-based customers,” said Art Ackerman, Henkel global product manager. “The company’s global leadership, in-depth understanding of mold design, broad equipment portfolio and low pressure molding expertise make LPMS USA a very competent partner.”
The low pressure molding process is an alternative to traditional potting techniques. Leveraging the capabilities of Henkel’s TECHNOMELT polyamide hotmelt products, LPMS USA systems process the materials in a simple operation that melts, molds, and cools the TECHNOMELT materials around electronic devices to encapsulate them and form self-enclosed, functional assemblies. Because the low pressure molding process is lower stress compared to traditional injection molding, it has reportedly been successfully used in multiple applications including automotive, LED lighting, medical, wearables and household consumer products.
For more information, visit www.henkel.com/electronics.
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