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Adhesives and Sealants TopicsAdhesives & Sealants HeadlinesFinished Adhesives and SealantsInfo for Packaging

Bostik Receives Supplier Innovation Award

Bostik recently announced it has received American Packaging Corp.’s (APC) first Supplier Innovation Award.

May 2, 2016

Bostik recently announced it has received American Packaging Corp.’s (APC) first Supplier Innovation Award.

APC is a flexible packaging converter specializing in flexographic and rotogravure printing, multi-ply extrusion and adhesive lamination of film, paper, and foil. In 2013, APC established a Supplier Innovation Award Program to recognize supply partners that reportedly go above and beyond supporting existing business, and though the program was created three years ago, APC had not found a supplier for the recognition until this year.

For a year and a half, Bostik has worked with APC’s Engineered Laminations and Coatings Center of Excellence to develop an extrudable hot melt resin system that can be applied using typical extrusion coating equipment. This system improves performance and stability of supply for APC’s customers and products. In addition, APC determined that this technology can have several other end uses, allowing the company to approach new markets and expand opportunities.

For more information, visit www.bostik-us.com. 

KEYWORDS: adhesives in packaging awards hot melts sealants in packaging

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