This company recently introduced a new adhesive for optoelectronic applications. DUALBOND OB786 can be used for fixing components within seconds, while reportedly ensuring precision and high strength.

This milky epoxy resin, with medium viscosity, can be used for fixing and bonding optoelectronic components. It reportedly ensures good adhesion to common substrates like aluminum, FR4, PPS and LCP.

DUALBOND OB786 cures under UV light at a wavelength of 365-nm in layers of up to 1.5 mm thickness. For areas that cannot be reached by the light because of the component’s design, like shadowed areas, as well as those areas that require a thicker adhesive layer, this dual-curing adhesive is exposed to heat in a convection oven for approximately 50 min. at 80°C to reach full strength.

This new adhesive features reduced outgassing and shrinkage. Its low coefficient of thermal expansion (CTE), matching both electronic components and PCBs can ensure a high optical quality, even in environments with temperatures that fluctuate.

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