Substrate-Backed Smart Damping Adhesive Patent Granted
This is reportedly in line with the company's emphasis on energy, resonance and vibration technologies and products.
Windgo Inc. recently announced that they have been granted U.S. Patent No.10,088,011 for a substrate-backed smart damping adhesive (SDA). This is reportedly in line with the company's emphasis on energy, resonance and vibration technologies and products. The adhesive is reportedly suitable to acoustical (noise) cancelling, production of smart building materials, automotive, robot skin, digital signage, and other industrial applications, as well as medical, aerospace, and other critical market applications.
For more information, visit www.windgo.com.
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