DOW: High-Solids Adhesive for High-Speed Metal Lamination
Designed to work on a broad range of medium-performance applications and packaging structures, Dow’s new adhesive reportedly offers up to 55% high-solids content in application.
Dow recently announced that it has expanded its portfolio of solvent-based adhesives with the new ADCOTE™ L76-500 high-solids adhesive, reportedly opening new opportunities beyond traditional metal-to-film lamination. Designed to work on a broad range of medium-performance applications and packaging structures, the adhesive reportedly offers up to 55% high-solids content in application, enabling converters to improve production efficiency and lamination speed while reducing energy costs and emissions.
“Converters operate in an increasingly competitive market, facing material and processing cost pressures,” said Izzat Midani, marketing manager EMEA at Dow Packaging and Specialty Plastics. “With the new ADCOTE™ high-solids adhesive we are providing our customers the opportunity to boost their competitiveness in the market with an efficient yet sustainable solution.”
The new high-solids adhesive is designed for applications such as stand-up pouches for condiments and sauces and personal care packaging. According to Dow, its properties make it suitable for a broad range of packaging structures such as laminates with metallized films, aluminum foil, OPA, PET, and barrier films, as well as triplex and quadruplex compositions with PE and cPP. Reportedly showing good wettability on most demanding films and excellent solvent release during drying, the new adhesive enables high lamination speeds up to 400 mpm.
“With the new ADCOTE™ high-solids adhesive, Dow delivers on specific customer requirements with sustainable production in mind,” said Daniele Vinci, application technology leader adhesives EMEA at Dow Packaging & Specialty Plastics. “The high solid content in application of the new adhesive enables low solvent emissions and reduced energy costs. In addition, the low monomer content qualifies it for an H351 free label and delivers a balanced PAA1 decay, while being free of Bisphenol A.”
For more information, visit www.dow.com.