Finished Adhesives and Sealants - Articles - Page 155

Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.

December 9, 2021

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.

Meridian Adhesives Group Relocates to Houston

Meridian has a portfolio of 14 international adhesive companies, with additional acquisitions pending.

December 8, 2021

To accommodate its growing international portfolio, Meridian Adhesives Group recently announced the strategic relocation of its corporate headquarters.

Deadline Nears for WAC 2022 Speaker Abstracts

The conference provides stakeholders in the adhesive and sealant industry an opportunity to present their expertise and innovations.

December 8, 2021

Organizers are accepting speaker abstracts through January 7 for the World Adhesive and Sealant Conference, which will be held April 25-27 in Chicago.

Photo of leaders from DuPont and the Zhangjiagang government at groundbreaking ceremony.

Top 5 News that Sticks

Readers Drawn to New DuPont Facility

DuPont’s recent groundbreaking in China drew the most reader interest last week.

Susan Sutton

December 6, 2021

Is your company expanding? We’d love to help share the news. Please send press releases to me at suttons@bnpmedia.com.

Photo of Arkema's new chief technology office, Armand Ajdari.

Ajdari Joins Arkema as Chief Technology Officer

Armand Ajdari will report to Thierry Le Hénaff, chairman and CEO.

December 6, 2021

Arkema recently announced that Armand Ajdari has been named chief technology officer, effective January 1, 2022.

Department of Commerce Establishes Industrial Advisory Committee for Microelectronics

The Industrial Advisory Committee will consist of expert leaders representing a range of organization sizes from industry, federal laboratories, and academic institutions.

December 6, 2021

The U.S. Commerce Department has established a high-level committee to advise the U.S. government on matters related to microelectronics research, development, manufacturing, and policy and is now seeking to recruit top-level candidates to serve on the committee.

ASC Reelects Board of Directors

Reelected members of the ASC board will serve a three-year term.

December 2, 2021

The Adhesive and Sealant Council (ASC) recently announced the reelection of members to its board of directors, as well as changes to its executive committee.

DAP: Hybrid Sealants, Anti-Shrink Latex Sealant

The new hybrid sealants can be used in extreme temperatures and prevent mold and mildew growth.

December 2, 2021

DAP recently announced new advanced hybrid sealants that outperform silicone and provide maximum performance.

PPG Produces 3D-Printed Ramp Seals for Lockheed Martin C-130J Super Hercules

The ramp seals are PPG’s first commercial sale of 3D-printed components.

December 2, 2021

PPG recently announced that it has supplied Lockheed Martin with sets of six custom-designed ramp seals for the aft loading ramp of the C-130J Super Hercules military tactical airlifter.

Bostik Provides Repair Solutions in International Yacht Race

Provided adhesives were reportedly chosen for their fast curing, high strength, and resistance to moisture, humidity, and chemicals.

December 1, 2021

Bostik recently announced that its adhesives, including solutions from the Born2Bond™ engineering adhesives range, comprise part of a repair kit that was offered by Arkema, Lalou Multi, and Bostik to all 79 teams in the Transat Jacques Vabre (TJV) multi-day yacht race.