Finished Adhesives and Sealants - Articles - Page 255

Novo to Become Ashland Chairman and CEO Upon Wulfsohn Retirement

William A. Wulfsohn will continue to serve as Ashland’s chairman and CEO through the end of the year to ensure a smooth transition.

October 11, 2019

Ashland Global Holdings Inc. recently announced that its board of directors has elected Guillermo Novo chairman and CEO of Ashland, effective December 31, 2019.

Sika Announces New Multi-Component Business Strategy

By targeting the six pillars of market penetration, innovation, operational efficiency, acquisitions, strong corporate values, and sustainability, Sika plans to grow by 6-8% per year up to 2023.

October 10, 2019

At the recent 2019 Sika Capital Markets Day, CEO Paul Schuler presented the company’s new Strategy 2023, which reportedly builds on the current growth model.

RPM Reports Record Net Sales in First 2020 Fiscal Quarter

RPM’s net sales in the fiscal 2020 first quarter were a record $1.47 billion, compared to $1.46 billion reported a year ago.

October 9, 2019

RPM International Inc. recently reported financial results for its fiscal 2020 first quarter ended August 31, 2019.

Bostik Receives Kao China Award

The Excellent Proposal Award is reportedly granted to Kao’s top vendors that made technical and commercial proposals dedicated to improving quality, performance, and cost.

October 8, 2019

Kao China granted the Excellent Proposal award to Bostik during its recent Vendor Summit in Shanghai.

Top 5 News that Sticks

Henkel Anniversary Celebration Leads the News

An announcement from Henkel regarding activities surrounding a major milestone drew the most reader interest last week.

Susan Sutton

October 7, 2019

Does your company have an anniversary or important milestone coming up? Please contact me at suttons@bnpmedia.com or (248) 786-1704 to share your story.

Winners of 16th Label Industry Global Awards Announced at Labelexpo Europe

The Label Industry Global Awards reportedly recognize the most innovative, influential, and successful work from the label and package printing industry across the globe in the last 12 months.

October 7, 2019

Avery Dennison, Esko, and GMG were among the category winners honored at this year’s Label Industry Global Awards, which took place on September 24 at Brussels Expo, Belgium, the first night of Labelexpo Europe 2019.

Growing Demand for Lightweight and Eco-Friendly Composites Propels Phenolic Resins Market

The adhesives application segment of the phenolic resins market is expected to see a significant growth rate and hold prominent market share through 2029.

October 7, 2019

Global demand for phenolic resins is expected to remain steady and grow at a CAGR of around 4% from 2019-2029.

Sartomer to Present Materials Solutions that Advance UV, LED, and EB Curing Systems at RadTech Europe 2019

In addition to showcasing products in the tabletop area, Sartomer representatives will give several presentations during the RadTech Europe conference.

October 4, 2019

Personnel from Sartomer, a business line of Arkema, will introduce materials solutions that reportedly advance the performance of energy-cured adhesives, 3D printing parts, inks, specialty coatings, and nail gels at RadTech Europe.

High-Speed Adhesive Dispensing for High-Voltage Batteries

The high viscosity and high proportion of abrasive fillers in the pastes, adhesives, and sealants used to assemble high-voltage batteries requires specialized dispensing and filling technologies.

Gabriele McFarland

October 4, 2019

Thermal influences can significantly affect the service life, capacity, and—above all—operational safety of high-voltage (HV) batteries.

Henkel Featuring Solutions for High-Reliability Applications at IMAPS 2019

Henkel materials and process personnel are sharing their know-how during several educational sessions throughout the IMAPS event.

October 2, 2019

Henkel’s presence at the IMAPS symposium, which is taking place September 30-October 3 in Boston, Mass., is reportedly centering on its expertise at the wafer and board level, with particular emphasis on solutions for aerospace electronics.