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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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HARVARD APPARATUS: Syringe Pump (8/6/09)

August 6, 2009
Harvard Apparatus recently introduced the PHD ULTRATM syringe pump, designed to meet today’s most demanding standards in fluidics applications.
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BEMATEK SYSTEMS INC.: Wet Mixer (8/5/09)

August 5, 2009
This company recently introduced a high-speed in-line mixer that processes all products directly through a patented mixing head and can be configured to meet precise user requirements.
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ROYAL ADHESIVES AND SEALANTS LLC: Contact Adhesives (8/4/09)

August 4, 2009
Royal Adhesives and Sealants LLC recently announced that it has launched a new line of Silaprene® brand low-volatile-content contact adhesives and cements.
Read More

CHARLES ROSS AND SON CO.: Ribbon Blender (8/3/09)

August 3, 2009
This company has announced the completion of a new model in its line of ribbon blenders.
Read More

GRACO: Melt Supply Systems (7/30/09)

July 30, 2009
This company’s new line of Warm Melt Supply Systems is engineered to reliably deliver one-component materials from drums to metering and dispensing systems.
Read More

HENKEL: Selector Guide (7/29/09)

July 29, 2009
New literature from Henkel Corp. provides detailed information on the company's line of adhesives, sealants, metal pretreatments, coatings, cleaners and metalworking fluids for a range of industrial assembly applications.
Read More

IPS CORP: Structural Adhesive (7/28/09)

July 28, 2009
WELD-ON ® 45 structural adhesive has received approval for Underwriters Laboratories (UL) specification 746C.
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PAM FASTENING TECHNOLOGY: Hot-Melt Cartridge Applicator (7/27/09)

July 27, 2009
PAM Fastening Technology introduces an improved hot-melt cartridge applicator with a large 3-mm extension nozzle and increased heating in the nozzle block area of the gun for easier spraying or improved extrusion of the adhesive.
Read More

HENKEL: Die Attach Solder Paste (7/23/09)

July 23, 2009
To address the thermal requirements posed by smaller-outline, higher-functioning-power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Read More

WACKER: Thermoplastic Encapsulant (7/22/09)

July 22, 2009
TECTOSIL®, a new thermoplastic encapsulant for the manufacture of photovoltaic modules, provides sensitive solar cells with effective and long-lasting protection against mechanical and chemical stresses.
Read More
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Structural Adhesives: Properties, Characterization and Applications

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