Kenics® KM Series Static Mixers from Chemineer Inc. feature a patented helical mixing element that produces complete radial mixing and flow division for any combination of liquids, gases or solids.
A silica-filled, low-viscosity, non-conductive die-attach paste, Hysol QM1600 provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mold compound properties, which enables wirebonds in same-size die-stack packages to survive thermal cycling.
The Binks EXEL Pump line, available in four models, was designed to meet the industry's demand for durability and dependability, while also delivering significantly more fluid than other horizontally opposed pumps at the same rate of air consumption.
Scapa North America now offers Unifilm U631A, a low-fogging adhesive transfer film for automotive assembly applications, including general assembly, trim attachment, and foam lamination for gasketing and NVH reduction.
FKI Logistex a global leader in integrated material-handling solutions, has introduced the Print-and-Apply Module, a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.
I&J Fisnar has announced the publication of Dispensing Robots for All Applications, the latest in a series of specialized catalogs featuring the dispensing equipment and accessories available from the company.
K-TEK, a leading manufacturer of state-of-the-art level instrumentation for liquid measurement, now offers the KM26 Magnetic Bargraph, a rugged liquid-level indicator designed for corrosive, flammable, and toxic environments.
TechFilm Corp. has introduced 12202F, a high-performance, structural B-staged film adhesive capable of developing a 4500 psi bond strength on difficult-to-bond metal substrates such as gold, invar, nickel and engineering and LCP plastics.
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