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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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DOW AUTOMOTIVE: Dashmat Construction

September 6, 2005
Dow Automotive has developed a new dashmat construction that enables engineers to block transfer of noise through the firewall while absorbing interior noise behind the instrument panel.
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ASI INSTRUMENTS: Bin Level Indicator For Bulk Solids Applications

August 29, 2005
ASI Instruments, a leading manufacturer of state-of-the-art instrumentation for level detection and measurement of dry bulk solids, has announced the availability of RotaryPoint, a new low-cost rotary paddle bin level indicator.
Read More

MOCON: Hot Tack Tester

August 29, 2005
New to the U.S., MOCON, Inc. is now marketing a hot tack tester loaded with features that is available at a significantly lower cost than similar testers on the market.
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SCAPA: Silicone Adhesive Tapes

August 29, 2005
Scapa North America now offers Scapa 572 and 573, two highly conformable polyester films, single-coated with a silicone adhesive for aerospace and industrial surface protection applications.
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VALCOR: Cryogenic Solenoid Valves

August 29, 2005
Valcor Engineering Corp., long one of the world's largest suppliers of cryogenic valves for the aerospace industry, has now leveraged its expertise to develop a family of commercial cryogenic solenoid valves for use in industrial applications.
Read More

JOWAT: High-Performance Adhesives

August 29, 2005
Jowat Corp. recently announced the introduction of its ViseTite™ line of professional adhesives.
Read More

CHARLES ROSS & SON CO.: Dual Shaft Mixer and Discharge System

August 29, 2005
Charles Ross & Son Co. has announced the development of its Model CDA 100 Dual Shaft Mixer and Discharge System for use in the production of viscous, non-flowing products.
Read More

HENKEL: Updated Bonding Guides

August 29, 2005
Henkel Corp. has thoroughly updated its three Loctite® Bonding Guides to include the most current information on adhesives, substrates and testing methodologies.
Read More

IPC: Lead-Free Solder Report

August 29, 2005
After three years of research and nearly $1 million spent in volunteer time and contributions, the IPC Solder Products Value Council has announced the release of its Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper - Final Report.
Read More

DTIC: Meter-Mix Dispense System

August 29, 2005
A powerful, fully automated meter-mix dispense system for highly abrasive and viscous materials (>1 million CPS) has been introduced by DTIC Dispensing Technologies of S. Lancaster, MA.
Read More
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