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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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DEVCON: Light-Cured Adhesives For Bonding Or Protecting

July 25, 2005
New light-cured Tru-Bond Series adhesives from Devcon cure in seconds when exposed to ultraviolet light, whether direct sunlight or a special UV lamp.
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BINKS: Fluid-Delivery Pump Line

July 25, 2005
The Binks EXEL Pump line, available in four models, was designed to meet the industry's demand for durability and dependability, while also delivering significantly more fluid than other horizontally opposed pumps at the same rate of air consumption.
Read More

SCAPA: Low-Fogging Transfer Film For Auto Assembly Applications

July 25, 2005
Scapa North America now offers Unifilm U631A, a low-fogging adhesive transfer film for automotive assembly applications, including general assembly, trim attachment, and foam lamination for gasketing and NVH reduction.
Read More

FKI LOGISTEX: Print-and-Apply Module

July 25, 2005
FKI Logistex a global leader in integrated material-handling solutions, has introduced the Print-and-Apply Module, a self-contained, fully-automated system designed to streamline and automate label printing and application in bar code, RFID or hybrid ID environments.
Read More

I&J FISNAR: Dispensing Robot Catalog

July 25, 2005
I&J Fisnar has announced the publication of Dispensing Robots for All Applications, the latest in a series of specialized catalogs featuring the dispensing equipment and accessories available from the company.
Read More

L.B. BOHLE: Impact Mill

July 25, 2005
L.B. Bohle has introduces the new Bohle Turbo Mill BTM for high-speed milling of dry or moist ingredients.
Read More

K-TEK: Magnetic Bargraph

July 25, 2005
K-TEK, a leading manufacturer of state-of-the-art level instrumentation for liquid measurement, now offers the KM26 Magnetic Bargraph, a rugged liquid-level indicator designed for corrosive, flammable, and toxic environments.
Read More

TECHFILM: B-Staged Adhesive Film

July 18, 2005
TechFilm Corp. has introduced 12202F, a high-performance, structural B-staged film adhesive capable of developing a 4500 psi bond strength on difficult-to-bond metal substrates such as gold, invar, nickel and engineering and LCP plastics.
Read More

POLYSCIENCES: Ultra-Fine Pitch Globtop Encapsulants

July 18, 2005
Polysciences, Inc., a leading manufacturer of specialty monomer/polymer formulations for electronic devices, has introduced two new NoSWEEP liquid globtop encapsulants specially formulated to protect ultra-fine pitch wire bonded, high-reliability devices.
Read More

TYCO: Extreme Weather Foil Tape

July 18, 2005
Tyco has announced the introduction of a new line of foil tapes specifically formulated to help heating ventilation and air conditioning (HVAC) systems withstand extreme temperatures.
Read More
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