THERM-A-GAP GEL 120 from Parker Chomerics is a reworkable, high-performance, one-component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K.
Tecbond 114 from Power Adhesives has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.