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NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesCuring

Deadline for Abstract Submission Extended for 2024 RadTech Conference

RadTech UV+EB Technology and Conference 2024

RadTech UV+EB Technology and Conference 2024. Courtesy of RadTech.

October 5, 2023

RadTech, the Association for UV+EB Technology, is admitting submissions for papers to be presented at the 2024 RadTech UV+EB Conference. The event takes place May 20-22, 2024, at the Hyatt Regency, Orlando, Florida. The association has extended the deadline for abstracts to October 13, 2023. 

The RadTech conference offers industry professionals the opportunity to stay at the forefront of UV/EB technology and learn about the latest advancements.

If accepted, the conference speaker will have the opportunity to share experiences and be part of the vibrant discussions around cutting-edge technologies and groundbreaking ideas.

The abstract should be no longer than 25 minutes in length with five minutes for Q&A. Those interested in presenting a conference paper should fill out the online abstract submission form. The description should be sufficiently comprehensive to allow assessment of the scope and content of the paper by the conference committee.

Find a complete list of suggested topics and additional details at www.radtech.org/radtech24.

Click here for the submission form. 


KEYWORDS: associations call for papers electron beam (EB) curing events ultraviolet (UV) curing

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