2025 ASI Top 20: LINTEC Corp.
Image courtesy of LINTEC.
Founded in 1934, LINTEC specializes in adhesive-based products, offering a wide range that includes adhesive papers and films for seals and labels, automotive applications, window films, semiconductor tapes and equipment, LCD-related materials, colored envelope papers, and release papers and films. Operating in around 19 countries and regions, the company employs about 5,476 people.
Total net sales for LINTEC were up 14.4% for the fiscal year that ended March 31, 2025. The company has three Japan-based consolidated subsidiaries, as well as approximately 39 additional consolidated subsidiaries around the world. Lintec specializes in four core technologies: adhesive applications, surface enhancement, specialty paper and release material production, and system development.
In the Printing and Industrial Materials Products business segment, 2024 fiscal year sales increased by 9.3%. This group produces products such as adhesives for automotive applications, adhesive tapes for industrial applications, adhesive papers and films for labels, and films for numerous additional applications, as well as many other products. The U.S.-based Mactac subsidiary is part of this segment.*
Sales in the Electronic and Optical Products segment increased by 30.3% overall. Products produced by this segment include tapes for semiconductor applications, multilayer ceramic capacitor-related tapes, and adhesives for touchscreen applications, among others.
(*Editor’s note: Since Mactac, LINTEC’s U.S. subsidiary, provided adhesives/sealants-related details and requested that they be withheld, specific sales levels for LINTEC will likewise not be published to avoid any potential conclusions being drawn. Mactac’s sales were subtracted when determining LINTEC’s ranking.)
NOTES: At the end of April 2024, the company announced the development of a new bump support film (BSF) that improves the durability and reliability of semiconductor chips, using resin to protect the ball bump interconnection between the die and substrate. The new product, a tape integrated with back grinding tape, became available on May 1, 2024.
In March 2025, Lintec announced that its new removable-type labelstock that features a newly developed hot-melt adhesive that allows labels to be repeatedly removed and reapplied. The labelstock is made from materials compliant with Japanese and U.S. food safety standards, adheres to wet and oily surfaces, and is easily removable to support recycling efforts.
Opening image courtesy of LINTEC Corp.
LINTEC Corp.
Tokyo, Japanwww.lintec-global.com
President and CEO: Makoto Hattori
Sources: investor presentation, summary of consolidated financial results
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