Adhesive for Medical Applications Bonds in Both Light and Shadowed Areas
According to the latest research, the global medical devices market reached $572 billion in 2025, with growth projected to reach $605 billion in 2026 to $1032 billion by 2034. This show a healthy compound annual growth rate of 6.9% over the forecast period. North America is expected to dominate the market, holding a 38% market share in 2025.
Among the drivers of growth are the increasing number of patients with acute and chronic diseases, including diabetes, cancer, and others, coupled with growing awareness regarding treatment options. The market has a high degree of innovation due to rapid technological advancements in areas such as smart devices, the increased use of AI and machine learning for diagnostics, growth in wearable medical technology, and ongoing development of telehealth solutions. Within this growing market, adhesives play a key role in the manufacture and safety of these devices. Dymax recently introduced a new addition to its HLC™ Adhesives portfolio, HLC-M-1004.
HLC-M-1004 is a low viscosity adhesive designed to support efficient assembly of complex medical devices. It expands the HLC™ Adhesives portfolio, which utilizes a hybrid light‑curable platform to support curing in both light‑exposed and shadowed areas. The adhesive combines on‑contact cure in dark areas with rapid, low‑intensity UV or visible‑light curing to support fast, reliable manufacturing.
Designed for medical device assembly, HLC-M-1004 is well-suited for applications involving catheters, diagnostic and therapeutic devices, and other parts that incorporate opaque or light-blocking substrates. The adhesive delivers low viscosity for controlled dispensing and penetration into tight bond gaps, enabling consistent bond formation without the need for primers.
Additional performance benefits include limited blooming with proper light curing, flexibility after cure, and improved aesthetics. The material provides rapid fixturing to support high-throughput manufacturing processes.
HLC-M-1004 has been evaluated in accordance with applicable ISO 10993 biocompatibility standards and contains no nonreactive solvents. As a one-part material, it helps manufacturers simplify processes, reduce waste, and improve overall production efficiency.
With the addition of HLC-M-1004, Dymax continues to expand the HLC Adhesive family to address evolving bonding challenges in medical device assembly environments.
Learn more at dymax.com.
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