Henkel’s presence at the IMAPS symposium, which is taking place September 30-October 3 in Boston, Mass., is reportedly centering on its expertise at the wafer and board level, with particular emphasis on solutions for aerospace electronics. As miniaturization and expanded function are impacting the entire electronics ecosystem—from bare wafers to integrated systems—new materials are required to cope with the effects of increased heat generation, exposure to harsh environments, and smaller package dimensions.

Henkel reports that it has developed a range of advanced formulations to address the challenges of today’s electronic realities. At IMAPS 2019, Henkel team members will deliver presentations on emerging technologies and will be available in the booth 408 to discuss several of the company’s enabling products, including:

• LOCTITE^® ABLESTIK CF 3366 is a silver-filled, epoxy-based assembly film formulated for extreme reliability that provides strong adhesion to facilitate reliable RF ground plane performance
• LOCTITE ECCOBOND UF 1173 is a one-component underfill that prioritizes health and safety (as per June 2018 REACH SVHC documentation) and protects array devices in a formulation that is compatible with higher temperature applications
• LOCTITE ABLESTIK ICP 9000 is a semi-sintering paste that offers a lead-free interconnect solution compatible with demanding conditions and operating temperatures as high as 200°C

Henkel materials and process personnel are sharing their know-how during several educational sessions throughout the IMAPS event, presenting on topics including thermal management techniques using thermal interface materials, advanced assembly materials for heterogeneous integration and 3D packaging, electrically conductive film adhesives for high-temperature compatibility and high-reliability performance, and innovative solder alloys for demanding automotive applications.