Toyo Ink America to Highlight Pressure Sensitive Adhesive Division at Adhesives & Bonding Expo
The Adhesives & Bonding Expo will run concurrently with Foam Expo in Novi, Mich., July 13-15, 2021.
Toyo Ink America, LLC recently announced that its Pressure Sensitive Adhesive Division will exhibit at the Adhesives & Bonding Expo, running concurrently with Foam Expo in Novi, Mich., July 13-15, 2021. A team of technical experts from the U.S. and Japan will be on hand at the Toyo Ink America booth #1021 to discuss the company’s product line.
Toyo reports that its Pressure Sensitive Adhesive Division develops products that reflect value to the marketplace. Examples include adhesives that allow for higher throughput speeds and reduce manufacturing costs, as well as new adhesives that provide performance and value to the pressure-sensitive industry.
“We are always challenging ourselves to develop and supply products which reflect true value to the marketplace,” said Joe Sentendrey, general manager of the division. “Our one-part and two-part Toyo Ink technologies of pressure sensitive adhesives are widely used for applications requiring: V.O.C. free, low outgas, heat resistance, low surface energy performance, chemical resistance, optical clarity, plasticizer resistance, removability or permanency.”
Nao Nakamura, general manager of the Polymer & Coating Research & Development Division of Toyochem Co., Ltd., a Toyo Ink Group company, will give a presentation on July 15. He will discuss “Staying Ahead of Global Regulatory Updates for VOCs to Meet Changing Industry Standards.”
For more information about Toyo Ink America, visit www.toyoink.com.
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