Nordson to Demonstrate Semiconductor Packaging Solutions at SEMICON Taiwan 2021
SEMICON Taiwan 2021 will take place December 28-30 in Taipei.
Nordson’s semiconductor packaging solutions for a smart and connected new world will be on display at SEMICON Taiwan 2021. (Image courtesy of Nordson Corp.)
Nordson Corp. recently announced that it will demonstrate its latest solutions for semiconductor packaging and electronics manufacturing at SEMICON Taiwan in Taipei, December 28-30, 2021. In booth I2716 on the first floor, company experts will be ready to discuss innovations for fluid dispensing, bond testing, X-ray inspection, and plasma surface treatment.
Nordson reports that its equipment is supported by trained and experienced technical staff who are ready to work with customers to improve their semiconductor packaging and electronics manufacturing operations. The Nordson team joins distributor partner CohPros to exhibit these technologies.
Nordson Electronics Solutions manufactures and supports equipment for precision automated fluid dispensing, conformal coating, plasma surface treatment, and selective soldering, from the product lines ASYMTEK, MARCH, and SELECT, to serve semiconductor packaging, printed circuit board assembly, and other precision assembly operations. Nordson Test & Inspection manufactures and supports a range of test and inspection products for the electronics industry. Offering a portfolio from the DAGE, MATRIX, SONOSCAN, and YESTECH product families, Nordson T&I offers solutions for the printed circuit board assembly (PCBA) and semiconductor industries.
Learn more at www.nordson.com/en.
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