Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing, and serviceability of miniaturized electronics such as wearables and handheld devices, as well as larger applications such as smart meters and LED lights. These methoxyethyl cyanoacrylate (MECA) and dual-cure Light Lock adhesives (patented in multiple countries) are already available for electronics OEMs for high-precision instant bonding, encapsulation, and potting applications. Coupled with automatic dispensing solutions, they provide high-performing and convenient options for designers and engineers.
Bostik reports that its new versatile and single-component hot-melt polyurethane reactive (HMPUR) range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices such as mobile phones, smart watches, and headphones. High-performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes. These adhesives reportedly deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.
The Born2Bond UV cure-in-place gasket (UV-CIPG) range provides single-component, precise gasketing solutions with typically 0.5-2 mm-high gaskets for waterproofing, dustproofing, and serviceability of mobile phones, tablets, smart watches, digital cameras, and automotive applications such as battery management systems (BMS), electronic control units (ECUs), and advanced driver-assistance systems (ADAS). The adhesives offer excellent adhesion to a variety of substrates, including plastic, glass, and metal, and provide an effective and cost-efficient solution to cut or molded gaskets that are typically assembled by hand with significant labor costs and carry a high risk of defect. They also eliminate the need for investment in expensive and space-consuming equipment such as molds and ovens.
The UV-CIPG range delivers a flexible and robust result that does not crack when compressed or deformed and that can withstand exposure to temperature fluctuations and chemicals. With high thixotropic indexes, the products provide a consistent bead aspect ratio and can be rapidly and precisely dispensed using automatic dispensing equipment.
For larger applications such as smart meters and LED lights where 2-5 mm-high gaskets are required for dust and waterproofing, Bostik’s UV foam gasket (UV-FG) range provides a fast-curing alternative to molded gaskets that can easily be integrated into manufacturing lines. The single-component design means mixing is not required, and a high-foam expansion enhances resilience during the assembly process.
“Wearable tech is a growing market and the requirement for ever-more-durable waterproof and dustproof electronics is increasing,” said Polivio Goncalves, Bostik’s global head for Engineering Adhesives. “These ranges have been designed to support engineers as the market continues to develop.”
Additional details are available at https://born2bond.bostik.com/en/home.