The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry. Thick film pastes and inks developed with ActiveCopper reportedly maintain excellent thermal and electrical conductivity while helping to address the effects of thermal expansion during the processing of and usage in electrical circuits and components. The products provide solutions for a wide range of applications, including via fills, die attach, EMI shielding, conductive adhesive, and more.

“The addition of the ActiveCopper™ suite of products enhances our robust thick film paste portfolio and enables us to further create new solutions for the electronics materials market,” said Fallyn Flaherty-Earp, global marketing leader for DuPont MCM. “The Kuprion team brings 13 years of R&D and formulation experience to these product lines. Combined with MCM’s extensive technical knowledge, we will be able to create unique and innovative solutions for our customers in key growth areas.”