The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry. Thick film pastes and inks developed with ActiveCopper reportedly maintain excellent thermal and electrical conductivity while helping to address the effects of thermal expansion during the processing of and usage in electrical circuits and components. The products provide solutions for a wide range of applications, including via fills, die attach, EMI shielding, conductive adhesive, and more.

“The addition of the ActiveCopper™ suite of products enhances our robust thick film paste portfolio and enables us to further create new solutions for the electronics materials market,” said Fallyn Flaherty-Earp, global marketing leader for DuPont MCM. “The Kuprion team brings 13 years of R&D and formulation experience to these product lines. Combined with MCM’s extensive technical knowledge, we will be able to create unique and innovative solutions for our customers in key growth areas.”

“Our closer collaboration with DuPont, a world leading technology and solutions provider, is part of our key initiative to drive our products to market,” said Nick Antonopoulos, CEO of Kuprion. “This partnership delivers the strength, certainty and service quality that is demanded by our customers. Right now, we are diligently working with DuPont and our customers to drive innovative solutions to the electronics industry. Together with DuPont’s products, solutions, and support, we improve our ability to deliver solutions to customers, with localized technical support.”

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