Organizers of the 2022 World Adhesive and Sealant Conference, which will be held April 25-27 in Chicago, Ill., have released the event’s preliminary program. The conference will feature more than 70 education sessions, as well as keynote addresses from industry and thought leaders.

The preliminary program also includes highlights of various networking events and information on the Hot Melt Adhesives Short Course and Emerging Leaders Workshop. Details regarding the host hotel, transportation options, and frequently asked questions are also provided.

Visit to view the program and for additional details.