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To blend raw material for plywood adhesives at higher rates with greater uniformity, the Willamette Valley Co. replaced a ribbon blender, which agitates material, with a rotary batch mixer, which tumbles it.

The Spitfire Heritage Trust recently completed a major project, successfully building an exact, full-sized all-fiberglass replica of the iconic WWII Battle of Britain Supermarine Spitfire Mk VB (Type 359) from scratch. Designed by Reginald Mitchell and produced from 1938-1948 at Supermarine Aviation where Mitchell was employed as an engineer, the original Spitfire fighter-interceptor was the first all-metal stressed-skin aircraft.

Adhesives and sealants manufacturers face unique challenges compared to other industries when undergoing lean or continuous improvement initiatives, including chemical reactions, vessels, batch sizes, curing times, long setups and required cleaning, regulatory mandates, and very technical processes that must be tightly controlled.

William (Bill) Allmond became president of the Adhesive and Sealant Council Inc. (ASC) in August 2016, after serving as vice president of the Society of Chemical Manufacturers and Affiliates for 10 years. Here, he discusses what he brings to the ASC, as well as his plans for 2017 and beyond.

From April 3-5, experts from across the adhesive and sealants industry will come together at the Adhesive and Sealant Council (ASC) Annual Spring Convention and Expo in Atlanta. The event offers speakers, short courses, an exhibition, and multiple networking opportunities for industry experts, clients, end users, and researchers to interact.

U.S. demand for silicones is forecast to climb 4.5% annually to $4.4 billion in 2020, with volume rising 2.6% per year to 908 million lbs (see Table 1). This will be a moderation in gains from the performance of the 2010-2015 period, which saw exceptional growth as a result of a broad economic recovery from the recession of 2007-2009. These and other trends are presented in “Silicones,” a recent study from The Freedonia Group.

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP).  The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.

The American Chemistry Council’s “Global Chemical Production Regional Index”1 (Global CPRI) shows that the 2016 second quarter ended on a soft note, with the headline index rising only 0.1% on a three-month moving average (3MMA) basis in June.

Regulations on volatile organic compound (VOC) emission have caused solventborne pressure-sensitive adhesives (PSAs) to be gradually replaced by hot-melt or waterborne PSAs.