Adhesives & Sealants Headlines

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Adhesives Research Inc. will be showcasing its latest ARclean electronically clean PSA technologies for hard disk drive assembly at the DISKCON USA 2003 Conference and Exhibition on September 9-10, 2003, in San Jose, CA.

The Adhesive and Sealant Council has announced that it will sponsor a new "Adhesive Forum" on Wednesday, Sept. 24, from 10:00 am to 1:00 pm., at Assembly Technology Expo 2003.

Rohm and Haas Co. has announced several new appointments within its global adhesives and sealants business.

Universal Instruments has announced the establishment of Dover Software India (DSI) in Bangalore, India.

Henkel Adhesives, Nordson Corp. and Aztek Specialty Products have announced a partnership to support low-pressure injection molding worldwide.

The United States Patent Office granted a patent to National Starch and Chemical for its application method for aqueous polymer dispersion to a substrate.

The Bonding Fundamentals Course, Aug. 25-29, in Cary, NC, is being offered by INDA and NCRC Prerequisite for attendance is a BS degree in engineering or textiles.

The Packaging Education Forum (PEF) has accepted the nominations of six career packaging professionals for induction into the Packaging Hall of Fame, Class of 2003.

Research Development & Design focuses on the entire product lifecycle including research, development and product design.

Stanley Silverman, president and CEO of the PQ Corp., has announced the appointment of Amy Ard as treasurer of the corporation.